Presentation
| Product type | BGA Screen |
Sale package
| Pack | Bulk |
| Content | BGA Stencils |
| Product status | New |
BGA Amaoe Screen, Universal (0.2 / 0.3 / 0.35 / 0.4 / 0.5)
BGA Amaoe Screen, Universal (0.2 / 0.3 / 0.35 / 0.4 / 0.5)
ID: 380831
PN: 6616001289A
Regular price
€15,79
Regular price
Sale price
€15,79
Unit price
per
Taxes included.
Shipping calculated at checkout.
6 months
In stock
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Delivery on time guaranteed
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Amaoe Universal BGA Stencil (0.2 / 0.3 / 0.35 / 0.4 / 0.5)
The set of two Amaoe universal BGA stencils represents a professional and highly versatile solution for reballing operations
and restoration of solder contacts (tin planting) on IC chips and processors of mobile devices. This premium kit is configured
with a wide range of hole configurations, including parallel slots, holes inclined at 45 degrees, and offset grids,
being capable of covering almost any current chip architecture on the smartphone market. The set is designed to offer technicians
multiple pin spacing options, from ultra-fine profiles of 0.2 mm and 0.3 mm, up to standards of 0.35 mm, 0.4 mm, and 0.5 mm.
Made from high-quality steel resistant to thermal deformation, these sheets ensure perfectly uniform solder paste distribution
and micrometric alignment, optimizing the success rate in GSM repair shops.
Features:
- Pin spacing options: 0.2 mm, 0.3 mm, 0.35 mm, 0.4 mm, and 0.5 mm
- Mesh hole configurations: Parallel holes, holes inclined at 45 degrees, and offset arrangement
- Material properties: High heat resistance, flexible steel resistant to deformation under hot air
- Main function: Formation and calibration of solder balls on integrated circuits (Tin Planting Template)
- Compatibility: Universal, suitable for most IC chips and CPUs used in phones and tablets
- Application: Precision micro-electronics, motherboard refurbishment, and professional GSM service